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Agentic solutions across the semi lifecycle

Accelerate execution from design verification through test readiness, silicon bring-up, and sustaining yield & quality—by automating triage, tightening release gates, and turning fragmented data into decisions.

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Production

Overview

Design

5 to 10x

faster execution across the manufacturing lifecycle

End-to-end silicon lifecycle

Our agents cover the entire manufacturing lifecycle

Design

Accelerate verification, debug, and sign-off. Faster tapeout, fewer respins, higher first silicon success

  • Translate design specs into RTL code automatically

  • Accelerate simulation and formal verification cycles

  • Diagnose and fix timing violations autonomously

Key Workflows

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Ramp

Compress learning loops from first silicon to volume readiness. Shorter NPI, more predictable releases, faster yield ramp

  • Draft comprehensive test plans from design requirements

  • Verify and debug automated test equipment programs

  • Analyze new product introduction test data for insights

Key Workflows

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Production

Detect, contain, and close the loop in production and in the field. Faster detection and containment

  • Identify excursion candidates, automate root cause analysis, and assign relevant team members to investigate

  • Assess defect contributors by yield impact and identify actionable root causes

  • Correlate process variables to yield loss and prioritize improvement experiments

Key Workflows

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Integrations

Works above your existing stack, not instead of it

Data is at the core of the silicon lifecycle. Emergence unifies your structured systems with unstructured engineering knowledge, then activates that unified layer through agentic workflows — without replacing your EDA tools or yield platforms.

Integrates with OptimalPlus GO and other yield platforms

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Connects EDA outputs, test systems, MES, QMS, and PLM

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Captures unstructured knowledge: FA reports, tickets, SOPs, tribal knowledge

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Human-in-the-loop with appropriate review and approval gates

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Semantic data fabric

Structured and unstructured data, in one place

Our platform aggregates and unifies a comprehensive range of structured and unstructured data across disparate enterprise applications and databases—creating a single, intelligent foundation that enables seamless correlation, analysis, and action across your entire semiconductor ecosystem.

Why Emergence

Workflow-first agents built for engineering execution

Not generic AI assistants. Purpose-built agentic systems trained on semiconductor domain knowledge, designed to deliver traceable results from day one.

Workflow-first agents

Each agent is purpose-built for specific engineering execution workflows — from regression triage to excursion containment — not generic chat that requires prompt engineering to get useful output.

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Traceable outputs

Every output carries evidence links — waveforms, test logs, prior debug sessions — providing the auditability and repeatability that safety-critical semiconductor workflows demand.

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Fast time-to-value

Start with 1–2 high-impact workflows and demonstrate ROI within weeks. Emergence is designed to scale incrementally across the full silicon lifecycle without a multi-year integration program.

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Semiconductor Leadership

Built by semiconductor veterans

Emergence is uniquely positioned to lead agentic AI for semiconductors because we sit at the rare intersection of world-class agentic AI systems and deep semiconductor execution experience.

Our team brings leadership backgrounds spanning IBM Research, IBM Microelectronics, and Broadcom, with experience across EDA and verification, silicon bring-up and production readiness, and advanced device/interconnect and packaging technologies.

In parallel, we have led and contributed to benchmark-leading agentic AI research and systems, including work associated with Agent E, BIRD-SQL, HELM, and LongMemEval, as well as advances in recursive intelligence which are essential for building scalable, reusable automation across many semiconductor workflows.

Together, we have:

  • Built and led agentic AI systems and evaluation efforts that push state of the art in tool use, long-horizon task execution, and memory-driven reasoning which are capabilities required to automate real semiconductor programs end-to-end.

  • Led advanced semiconductor technology programs at IBM Research and IBM Microelectronics, spanning interconnect innovations, advanced materials, device technology transitions (FinFET/ETSOI), and packaging.

  • Delivered major EDA/compiler optimization advances for ASIC and server-class chips, including a 50× Verilog compilation speedup recognized with an Outstanding Technical Achievement Award.

  • Supported FinFET adoption and chip bring-up at Broadcom, working closely with foundry partners and business units through critical ramp phases.

  • Produced a sustained record of invention and publication with 300+ papers and 200+ U.S. patents, including recognition such as IBM Master Inventor status, and major IEEE-level innovation awards.